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ASML and TSMC launch a long-term High-NA EUV photomask initiative

ASML and TSMC formed an industry initiative to move High-NA EUV manufacturing toward 12-inch photomasks. The partners target a pilot line by 2031 and readiness for advanced-node production by 2033, while TSMC intends to introduce ASML High-NA technology into high-volume manufacturing from 2030.